Advanced package
  • WL CSP
  • FC DFN
  • SiP
Laminate
  • TFBGA
  • Fine Pitch BGA (FBGA)
  • Very Fine Pitch BGA (VFBGA)
  • MCM-PBGA
  • Land Grid Array (LGA)
Tape (or Driver IC application)
  • Tape Carrier Package (TCP)
  • Chip on Film (COF)
  • Chip On Glass (COG)
LeadFrame
  • QFN
  • QFP
  • LQFP
  • TQFP
  • Multi-Chip & Stacked Leadframe
  • SOP
  • TSOP (I) and (II)